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 R2A20113DD/SP
Critical Conduction Mode PFC Control IC
REJ03F0279-0100 Rev.1.00 Oct 10, 2008
Description
The R2A20113 controls a boost converter to provide a active power factor correction. The R2A20113 adopts critical conduction mode for power factor correction and realizes high efficiency and a low switching noise by zero current switching. Because the zero current is detected by using the GND current, the ZCD Auxiliary winding is unnecessary. The feedback loop open detection, two mode overvoltage protection, overcurrent protection are built in the R2A20113, and can constitute a power supply system of high reliability with few external parts.
Features
* Absolute Maximum Ratings Supply voltage Vcc: 24 V Operating junction temperature Tjopr: -40 to +150C * Electrical characteristics UVLO operation start voltage VH: 12 V 0.8 V UVLO operation shutdown voltage VL: 9.2 V 0.7 V UVLO hysteresis voltage Hysuvl: 2.8 V 0.7 V * Functions Boost converter control with critical conduction mode Two mode overvoltage protection Mode1: Dynamic OVP corresponding to a voltage rise by load change Mode2: Static OVP corresponding to overvoltage in stable Feedback loop open detection Overcurrent protection Package lineup: Pb-free SOP-8 (JEDEC)/DILP-8
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 1 of 6
R2A20113DD/SP
Pin Arrangement
FB COMP RT VREF 1 2 3 4 8 7 6 5 VCC OUT GND CS
(Top view)
Pin Functions
Pin No. 1 2 3 4 5 6 7 8 Pin Name FB COMP RT VREF CS GND OUT VCC Input/Output Input Output Input/Output Output Input -- Output Input Function Error amplifier input terminal Error amplifier output terminal A resistor connection terminal for RAMP current setting Reference voltage output terminal Zero current detection and overcurrent detection input terminal Ground Power MOSFET drive terminal Supply voltage terminal
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 2 of 6
R2A20113DD/SP
Block Diagram
VREF 4
VREF: 5V
UVLO ON: 12V OFF: 9.2V
8 VCC
27.5V
Zero Current Detector
SQ RQ
Delay
7 OUT
Restart
SQ RQ
GD Disable
40k
CS 5
5p
OCP COMP - +
6 GND
-0.4V
OVP BLOCK
COMP Discharge
- +
FB
RT 3
1V 10p
Ramp Low Detect - + 0.2V
SQ R
Error Amp - + 2.51V
1 FB
2 COMP
4.0V
Static OVP
+
FB
VFB x 1.09V/100mVhys
GD Disable
-
COMP Discharge
Dynamic OVP
+
-
VFB x 1.05V
-
+
FB open detect
0.5V/0.2Vhys
OVP BLOCK
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 3 of 6
R2A20113DD/SP
Absolute Maximum Ratings
(Ta = 25C)
Item Supply voltage OUT peak current OUT DC current COMP terminal current RT terminal current Vref terminal current Vref terminal voltage FB terminal voltage CS terminal voltage Power dissipation Operating junction temperature Storage temperature Notes: 1. 2. 3. 4. Symbol Vcc Ipk-out Idc-out Icomp Irt Iref Vt-ref Vt-fb Vcs Pt Tj-opr Tstg Ratings -0.3 to 24 0.9 100 1 -50 -5 -0.3 to Vref + 0.3 -0.3 to +5 -1.5 to +0.3 0.68 -40 to +150 -55 to +150 Unit V A mA mA A mA V V V W C C Note 3
4
Rated voltages are with reference to the GND terminal. For rated currents, inflow to the IC is indicated by (+), and outflow by (-). Shows the transient current when driving a capacitive load. In case of R2A20113DD (DILP): ja = 120C/W In case of R2A20113SP (SOP): ja = 120C/W This value is a thing mounting on 40 x 40 x 1.6 [mm], a glass epoxy board of wiring density 10%.
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 4 of 6
R2A20113DD/SP
Electrical Characteristics
(Ta = 25C, Vcc = 12 V, CS = GND, FB = COMP, RRT = 200 k)
Item Supply UVLO turn-on threshold UVLO turn-off threshold UVLO hysteresis Standby current Operating current VREF Reference voltage Line regulation Load regulation Temperature stability Error amplifier Feedback voltage Input bias current Open loop gain Upper clamp voltage Low voltage Source current Sink current 1 Sink current 2 Transconductance RT Zero current detector Restart OUT RAMP offset voltage RT voltage ZCD threshold voltage Input bias current Restart time delay Rise time Fall time OUT low voltage OUT high voltage Over current protection Over voltage protection Dynamic OVP threshold voltage Static OVP threshold voltage Static OVP hysteresis FB open detect threshold voltage FB open detect hysteresis Vdovp Vsovp Hys-sovp Vfbopen Hysfbopen VFBx 1.035 VFBx 1.075 50 0.45 0.16 VFBx 1.050 VFBx 1.090 100 0.50 0.20 VFBx 1.065 VFBx 1.105 150 0.55 0.24 V V mV V V COMP = Open COMP = Open COMP = Open COMP = Open OCP threshold voltage Symbol Vuvlh Vuvll Hysuvl Istby Icc Vref Vref-line Vref-load dVref Vfb Ifb Av Vclamp-comp Vl-comp Isrc-comp Isnkcomp1 Isnkcomp2 gm Voff-ramp V-rt Vzcd Ics Tstart tr-out tf-out Vol1-out Vol2-out Voh-out Vocp Min 11.2 8.5 2.1 -- -- 4.85 -- -- -- 2.41 0.1 -- 3.75 -- -185 -- 180 90 -- 1.8 -8 -80 65 -- -- -- -- 11.5 -0.44 Typ 12 9.2 2.8 95 2.6 5.00 5 5 80 2.51 0.25 55 4.0 0.1 -120 120 300 150 1.0 2.0 -2 -47 130 30 30 0.08 0.05 11.9 -0.4 Max 12.8 9.9 3.5 180 4 5.15 20 20 -- 2.61 0.75 -- 4.25 0.3 -40 -- 450 220 -- 2.2 0 -20 280 100 100 0.2 0.7 -- -0.36 Unit V V V A mA V mV mV ppm/C V A dB V V A A A S V V mV A s ns ns V V V V Vcs = 0 V FB = 2.0 V, COMP = 2.5 V CL = 1000 pF, FB = 2.0 V, COMP = 2.5 V CL = 1000 pF, FB = 2.0 V, COMP = 2.5 V Isink = 20 mA Isink = 10 mA, Vcc = 5 V Isource = -20 mA *
1
Test Conditions
Vcc = Vuvlh - 0.2 V Isource = 0 mA Isource = 0 mA, Vcc = 10 V to 24 V Isource = 0 mA to -5 mA Ta = -40 to 125C * FB-COMP short Measured pin: FB *1 FB = 2.0 V, COMP: Open FB = 3.0 V, COMP: Open FB = 1 V, COMP = 2.5 V *1 FB = 3.5 V, COMP = 2.5 V FB = 2.5 V, COMP = 2.5 V *1 RT = 200 k
1
Note:
1. Design spec.
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 5 of 6
R2A20113DD/SP
Package Dimensions
JEITA Package Code P-DIP8-6.3x9.6-2.54 RENESAS Code PRDP0008AF-A Previous Code DP-8B MASS[Typ.] 0.51g
D
8
5
1 0.89 b3
4
Z
A1
A
E
Reference Symbol
Dimension in Millimeters
Min
e
bp
e1
c
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 9.6 10.6 6.3 7.4 5.06
L
0.5 0.38 0.48 0.58 1.3 0.20 0.25 0.35 0 15 2.29 2.54 2.79 1.27 2.54
JEITA Package Code P-SOP8-3.95x4.9-1.27
RENESAS Code PRSP0008DD-C
Previous Code FP-8DCV
MASS[Typ.] 0.085g
*1
D
F
8
5
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
E
*2
HE
Index mark
Terminal cross section ( Ni/Pd/Au plating )
1
Z
e
c
4
*3
Reference Dimension in Millimeters Symbol
bp
x
M
L1
A1
L
y
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 4.90 5.30 3.95
0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0 8 5.80 6.10 6.20 1.27 0.25 0.10 0.75 0.40 0.60 1.27 1.08
REJ03F0279-0100 Rev.1.00 Oct 10, 2008 Page 6 of 6
A
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. 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Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
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(c) 2008. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2


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